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BRD2605A Dev Kit

The BRD2605A dev kit is Silicon Labs' official SiWx917 Wi-Fi 6 & Bluetooth LE Dev Kit (SiWx917-DK2605A), with TuyaOpen board support. On-board SEGGER J-Link debugger.

Silicon Labs BRD2605A evaluation board
Silicon Labs BRD2605A evaluation board

Software build configurationโ€‹

The board configuration file defines the configuration parameters for peripheral drivers, pin mapping, the BSP package, and third-party libraries. Building with the kit's preconfigured board file saves most of the hardware adaptation effort.

:::tip Want to develop new peripherals? Config notes:

  • To add peripherals, write the drivers at the application layer. BSP drivers mainly serve the peripherals fixed on the board.
  • Peripheral needs differ between applications; adjust the Config file accordingly.
  • Different applications may need different third-party library parameters.
  • Recommended: treat the initial configuration file as the board base template and extend it for your own development. :::

Hardware overviewโ€‹

The kit shares its toolchain with Silicon Labs' official flow: the SDK board definition comes from the brd2605a configuration shipped inside the WiseConnect SDK, and the on-board debugger exposes both J-Link SWD and a virtual COM port (VCOM). The board also carries temperature/humidity, ambient-light, and 6-axis sensors plus a Qwiic connector.

Kit highlightsโ€‹

  • SiWG917M111MGTBA module
  • ARM Cortex-M4 @ 180 MHz
  • 8 MB flash + 320 kB on-chip RAM
  • On-board SEGGER J-Link and virtual COM port (VCOM), one USB Type-C cable for flashing and logs
  • Temperature/humidity, ambient-light, and 6-axis inertial sensors
  • MEMS stereo microphone
  • RGB LED and two buttons (BTN0/BTN1)
  • Two-row EXP1A/EXP1B expansion header, Qwiic connector

Detailed specificationsโ€‹

FeatureSpecification
On-board moduleSiWG917M111MGTBA
CPUARM Cortex-M4 @ 180 MHz
WirelessWi-Fi 6 (802.11ax, 2.4 GHz) + Bluetooth LE, 2.4 GHz ceramic chip antenna
Flash / RAM8 MB flash, 320 kB on-chip RAM
SensorsTemperature/humidity, ambient light, 6-axis inertial
AudioMEMS stereo microphone
InteractionRGB LED, two buttons (BTN0/BTN1)
Expansion26-pin 2.54 mm dual-row header (EXP1A/EXP1B), Qwiic connector
DebugOn-board SEGGER J-Link + virtual COM port (VCOM), USB powered

Pin definitionsโ€‹

Breakout headersโ€‹

Expansion signals are brought to a 26-pin 2.54 mm dual-row header, with the odd row silkscreened EXP1A and the even row EXP1B.

EXP1Aโ€‹

PinSignalPinSignal
1VMCU15SENSOR_I2C (SCL)
3SDIO CLK17BOARD_ID_I2C
5SDIO CMD19BOARD_ID_I2C
7SDIO D021GPIO_6
9SDIO D123GPIO_10
11SDIO D225GPIO_12
13SDIO D3

EXP1Bโ€‹

PinSignalPinSignal
2VMCU16SENSOR_I2C (SDA)
4IMU SPI CLK18NC
6IMU SPI CS20NC
8IMU SPI MOSI22GPIO_11
10IMU SPI MISO24GPIO_7
12VCOM TX26GND
14VCOM RX

Notes:

  • SENSOR_I2C is the bus of the on-board sensors; BOARD_ID_I2C is the board-identification I2C (routed through 4.7 kฮฉ resistors). Both can serve as general-purpose I2C when you expand the board.
  • The six SDIO lines and four IMU SPI lines expose chip interfaces on the header; if you don't attach an SDIO device, those 10 pins work as GPIOs.
  • VCOM wires the debugger's virtual UART straight to the header; mind the overlap with the USB virtual COM when attaching serial devices.

Debugging does not consume the expansion header: the on-board J-Link (SWD) and VCOM work directly over USB Type-C with no wiring. For background, see the UG581 user guide.

Board-level pinsโ€‹

FunctionKconfigTUYA GPIOChip padRegistered name
Button 1BOARD_SW1_PIN49HP 49SW1
Button 2BOARD_SW2_PIN2UULP 2SW2
Button 3BOARD_SW3_PIN3UULP 3SW3
LED RBOARD_LEDR_PIN50HP 50LEDR
LED GBOARD_LEDG_PIN51HP 51LEDG
LED BBOARD_LEDB_PIN15HP 15LEDB

Downloadsโ€‹

BRD2605A boardโ€‹

SiWx917 chip documentation (Silicon Labs)โ€‹