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BRD2605A Dev Kit

The BRD2605A dev kit is Silicon Labs' official SiWx917 Wi-Fi 6 & Bluetooth LE Dev Kit (SiWx917-DK2605A), with TuyaOpen board support. On-board SEGGER J-Link debugger.

Silicon Labs BRD2605A evaluation board
Silicon Labs BRD2605A evaluation board

Software build configuration

The board configuration file defines the configuration parameters for peripheral drivers, pin mapping, the BSP package, and third-party libraries. Building with the kit's preconfigured board file saves most of the hardware adaptation effort.

:::tip Want to develop new peripherals? Config notes:

  • To add peripherals, write the drivers at the application layer. BSP drivers mainly serve the peripherals fixed on the board.
  • Peripheral needs differ between applications; adjust the Config file accordingly.
  • Different applications may need different third-party library parameters.
  • Recommended: treat the initial configuration file as the board base template and extend it for your own development. :::

Hardware overview

The kit shares its toolchain with Silicon Labs' official flow: the SDK board definition comes from the brd2605a configuration shipped inside the WiseConnect SDK, and the on-board debugger exposes both J-Link SWD and a virtual COM port (VCOM). The board also carries temperature/humidity, ambient-light, and 6-axis sensors plus a Qwiic connector.

Kit highlights

  • SiWG917M111MGTBA module
  • ARM Cortex-M4 @ 180 MHz
  • 8 MB flash + 320 kB on-chip RAM
  • On-board SEGGER J-Link and virtual COM port (VCOM), one USB Type-C cable for flashing and logs
  • Temperature/humidity, ambient-light, and 6-axis inertial sensors
  • MEMS stereo microphone
  • RGB LED and two buttons (BTN0/BTN1)
  • Two-row EXP1A/EXP1B expansion header, Qwiic connector

Detailed specifications

FeatureSpecification
On-board moduleSiWG917M111MGTBA
CPUARM Cortex-M4 @ 180 MHz
WirelessWi-Fi 6 (802.11ax, 2.4 GHz) + Bluetooth LE, 2.4 GHz ceramic chip antenna
Flash / RAM8 MB flash, 320 kB on-chip RAM
SensorsTemperature/humidity, ambient light, 6-axis inertial
AudioMEMS stereo microphone
InteractionRGB LED, two buttons (BTN0/BTN1)
Expansion26-pin 2.54 mm dual-row header (EXP1A/EXP1B), Qwiic connector
DebugOn-board SEGGER J-Link + virtual COM port (VCOM), USB powered

Pin definitions

Breakout headers

Expansion signals are brought to a 26-pin 2.54 mm dual-row header, with the odd row silkscreened EXP1A and the even row EXP1B.

EXP1A

PinSignalPinSignal
1VMCU15SENSOR_I2C (SCL)
3SDIO CLK17BOARD_ID_I2C
5SDIO CMD19BOARD_ID_I2C
7SDIO D021GPIO_6
9SDIO D123GPIO_10
11SDIO D225GPIO_12
13SDIO D3

EXP1B

PinSignalPinSignal
2VMCU16SENSOR_I2C (SDA)
4IMU SPI CLK18NC
6IMU SPI CS20NC
8IMU SPI MOSI22GPIO_11
10IMU SPI MISO24GPIO_7
12VCOM TX26GND
14VCOM RX

Notes:

  • SENSOR_I2C is the bus of the on-board sensors; BOARD_ID_I2C is the board-identification I2C (routed through 4.7 kΩ resistors). Both can serve as general-purpose I2C when you expand the board.
  • The six SDIO lines and four IMU SPI lines expose chip interfaces on the header; if you don't attach an SDIO device, those 10 pins work as GPIOs.
  • VCOM wires the debugger's virtual UART straight to the header; mind the overlap with the USB virtual COM when attaching serial devices.

Debugging does not consume the expansion header: the on-board J-Link (SWD) and VCOM work directly over USB Type-C with no wiring. For background, see the UG581 user guide.

Board-level pins

FunctionKconfigTUYA GPIOChip padRegistered name
Button 1BOARD_SW1_PIN49HP 49SW1
Button 2BOARD_SW2_PIN2UULP 2SW2
Button 3BOARD_SW3_PIN3UULP 3SW3
LED RBOARD_LEDR_PIN50HP 50LEDR
LED GBOARD_LEDG_PIN51HP 51LEDG
LED BBOARD_LEDB_PIN15HP 15LEDB

Downloads

BRD2605A board

SiWx917 chip documentation (Silicon Labs)